Optosem specializes in Air Cavity Package design, which includes Pre-molded Lead Frames and LCP Lids or LCP Housings. To facilitate our design process, customers typically provide us with the IC Die Size, Wire Bonding Diagram, Package Outline, and other relevant information.

With this information, we proceed with the Input Review, Product Structuring, and Design.

Once the design is completed, we provide the Product Drawing and Product DFM (Design for Manufacturing) to the customer for further discussion and approval. After finalizing the product, we proceed to the next step.

Back to Service Line-up